Micro- and Opto-Electronic Materials and Structures: by Ephraim Suhir, Y.C. Lee, C.P. Wong

By Ephraim Suhir, Y.C. Lee, C.P. Wong

Micro- and Opto-Electronic fabrics and buildings: Physics, Mechanics, layout, Reliability, Packaging is the 1st entire connection with acquire and current the main, updated, in-depth, sensible and easy-to-use details at the physics, mechanics, reliability and packaging of micro- and opto-electronic fabrics, assemblies, buildings and platforms. The chapters in those volumes comprise summaries of the cutting-edge and current new info on lately built very important tools or units. additionally, functional innovations are provided on how one can effectively practice present wisdom and lately built know-how to layout, manufacture and function possible, trustworthy and reasonable digital elements or photonic units. The emphasis is at the technology and engineering of digital and photonic packaging, on actual layout difficulties, demanding situations and options. quantity I makes a speciality of physics and mechanics of micro- and opto-electronic constructions and structures, i.e., at the technology underpinnings of engineering equipment and ways utilized in microelectronics and photonics. quantity II offers with numerous functional elements of reliability and packaging of micro- and opto-electronic platforms. across the world well-known specialists and global leaders specifically parts of this department of utilized technology and engineering contributed to the e-book. subject matters addressed within the e-book comprise, yet aren't restricted to, the next: physics and mechanics of polymer fabrics; underfills; electrically conductive adhesives; plastic applications of IC units; lead loose solders; flip-chip programs; moveable electronics; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and pressure trying out and speeded up existence checking out; solder joint fabrics and applied sciences in addition to lead-free solder fabrics and joints; reliability of cellular digital items, photonic fabrics, optical fibers and energetic and passive optical elements; thermal phenomena in micro- and opto-electronic structures and thermal stresses; adhesion difficulties and strategies; skinny movie fabrics, physics and mechanics; photorefractive fabrics and units; nanomaterials and nanotechnology; multiphysics modeling and optimization applied sciences; experimental tools and methods; trying out tools and methods, subjected to thermal loading, tension analyses of processed silicon wafers, and so forth. The publication is meant as a reference resource and as a handbook for electric, fabrics, mechanical, and reliability engineers, in addition to utilized physicists and fabrics scientists. The booklet may be a necessary software for all people who find themselves concerned or drawn to cutting-edge within the research, layout and production of micro- and opto-electronic structures.

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Extra resources for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics Materials ... Physical Design Reliability and Packaging

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4. 4. 1. 2. 3. 4. 5. 5. Summary Acknowledgments References 71 71 71 72 80 81 81 83 85 87 89 93 95 95 100 102 104 105 105 108 110 110 115 116 116 116 Chapter 4 Metallurgical Interconnections for Extreme High and Low Temperature Environments George G. 1. 2. 1. 2. 3. 3. 4. 5. 6. P. 1. 2. 1. 2. 3. 3. 1. 2. 4. 5. 6. W. C. 1. 2. 3. 1. 2. 4. 1. 2. 3. 4. 5. 5. 6. 7. Conclusions and Discussion References 137 137 139 139 141 142 143 145 145 149 149 151 151 152 158 158 161 162 162 163 164 164 165 168 170 172 172 Reliability and Packaging Chapter 7 Fundamentals of Reliability and Stress Testing H.

4. 1. 2. 3. 1. 2. Moisture Transport Behavior References 432 433 433 434 435 438 442 442 444 447 449 449 451 452 461 462 469 Chapter 18 Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications E. Suhir and D. 1. 1. 2. 3. 4. 3. 1. 2. 3. 4. 1. 2. 3. 4. 5. 2. 3. 4. 5. 6. 1. 2. 1. 2. 3. 1. 2. 3. 4. 1. 2. 5. Summary and Recommendations Acknowledgments References Chapter 20 Electrically Conductive Adhesives: A Research Status Review James E. 1. 1. 2. 3. 4. 2. 1. 2. 3. 3. 1. 2. 3.

1. 2. 3. 2. 1. 2. 3. 4. 5. 6. 7. 3. 1. 2. 3. 4. 5. 6. 7. 8. 4. 1. 2. 3. 4. 5. 1. 6. 7. 1. 2. 3. Length Scale References Chapter 5 Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges Alan M. 1. 1. 2. 3. 4. 2. 1. 2. 3. 1. 2. 4. 1. 2. 3. 4. 5. 5. Summary References Chapter 6 Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems A. Q. D. J. 1. 2. 1. 2. 3. 4. 3. 1. 2. 3. 4. 4. 1. 2. 5. 6. List of Acronyms Acknowledgments References 187 189 191 191 191 194 194 196 198 198 199 200 200 205 205 206 208 211 215 219 225 226 236 242 249 252 252 253 259 264 264 264 Materials Mechanics Chapter 7 Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension E.

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