By Deborah D.L. Chung
Even if fabrics play a serious function in digital packaging, the majority of cognizance has been given to the platforms point. fabrics for digital Packaging goals fabrics engineers and scientists by means of targeting the fabrics point of view. the previous couple of many years have visible great development in semiconductor expertise, making a desire for powerful digital packaging. fabrics for digital Packaging examines the interconnections, encapsulations, substrates, warmth sinks and different parts all for the packaging of built-in circuit chips. those packaging schemes are an important to the final reliability and function of digital structures. contains sixteen self-contained chapters, contributed by means of a number of lively researchers from business, educational and governmental sectors. Addresses the necessity of fabrics scientists/engineers, electric engineers, mechanical engineers, physicists and chemists to procure a radical wisdom of fabrics technological know-how. Explains how the fabrics for digital packaging ensure the general effectiveness of digital structures.
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Even though fabrics play a severe position in digital packaging, the majority of cognizance has been given to the structures point. fabrics for digital Packaging objectives fabrics engineers and scientists by way of concentrating on the fabrics viewpoint. the previous few many years have visible large development in semiconductor know-how, making a desire for potent digital packaging.
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Additional resources for Materials for Electronic Packaging
SiO 2, Si3Ni4, silicon oxynitride). 16 . 7. The molding material is typically a polymer, such as epoxy. 16 Flow charge of integrated circuit packaging. P. 17 1 ~ ~ KOVAR CAN [-. 51G \ ,,, ALUMINA SUBSTRATE FRAME Cross section of a multichip module of General Electric Company. From [ 10]. silicate), SiO2, and so on. A ceramic is advantageous (compared to a polymer) in its low coefficient of thermal expansion and higher thermal conductivity, but it is much less convenient to apply than a polymer.
In general, the conductive filler can be in the form of particles, flakes, short fibers, or continuous fibers. Long fibers are more effective than short fibers. , A1 and Cu) are most commonly used [93-95], but metal-coated carbon fibers are increasingly used . The mechanism of shielding includes absorption and reflection; it depends on the material and the frequency of the radiation. Increasing the volume fraction of the conductive filler the shielding effectiveness of the composite. However, a high filler content may result in a low tensile strength in the composite, so there is a compromise between its electrical and mechanical properties .
B. M. M. S. W. H. L. Young, in Proc. , IEEE, 1989, pp. 135-142. 77. S. S. Liu, R. Guida, and J. Rose, in Proc. SPIE, hit. Soc. Opt. , g77 (Micro-Optoelectron. ), 92-96 (1988). 78. T. Studt, R&D Magazine, Aug. 1992, pp. 30-34. 79. W. Lin, in Proc. , IEEE, 1989, pp. 148-154. 80. C. , Adv. Mater. , Feb. 1989, pp. 42-47. 81. T. Chen, F. S. Ho, in Microelectronic Packaoin9 Technology, Proc. 2nd A S M Int. Electronic Materials and Processing Congress, Philadelphia, PA, Apr. T. Shieh, ASM International, 1989, pp.