A Guide to Lead-free Solders: Physical Metallurgy and by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing.

By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)

While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing swap. subsidized by way of greater than ten years of analysis in Pb-free solders, many electronics brands are poised for conversion.

A advisor to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the creation and use of solders. an outline of the foundations of soldering expertise is equipped starting with the idea underlying each one idea. targeting the main up to date equipment for trying out and characterization, those theories are then strengthened by means of experimental examples and business applications.

• Addresses key matters in meeting from a fabrics element of view.

• provides the reader handy entry to info crucial for the correct overview and employment of state of the art ternary Sn/Ag/X solders

• permits comparability of the functionality of Pb-free solders with that of normal eutectic SnPb.

Although basically of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A advisor to Lead-free Solders can also be useful for graduate scholars seeking to practice services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent learn at their fingertips including the most likely instructions will desire from such study within the future.

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Extra info for A Guide to Lead-free Solders: Physical Metallurgy and Reliability

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Tu, K. , Celestre, R. , MacDowell, A. , Bong, Y. , Sheng, G. , (2002), Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, 2002. , (2002) Relay Failure Caused by Tin Whiskers, 2002. , (1989) “Reflow Soldering Survey”, Circuits Manufacturing, p. 42, 1989. Dubravka Rocak, Vinko Stopar, and Janeta Fajfar Plut, (1995), “Solder Paste for Fine Line Printing in Hybrid Microelectronics”, J. of Microelectronics, 26, 1995, pp. , (1987) Process Optimization of Solder Creams, unpublished monograph, 1987.

Celestre, R. , MacDowell, A. , Bong, Y. , Sheng, G. , (2002), Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, 2002. , (2002) Relay Failure Caused by Tin Whiskers, 2002. , (1989) “Reflow Soldering Survey”, Circuits Manufacturing, p. 42, 1989. Dubravka Rocak, Vinko Stopar, and Janeta Fajfar Plut, (1995), “Solder Paste for Fine Line Printing in Hybrid Microelectronics”, J. of Microelectronics, 26, 1995, pp. , (1987) Process Optimization of Solder Creams, unpublished monograph, 1987.

2003) A Discussion of the Significance of Metal Whisker Formation to the High Reliability Community. CALCE Center, (2003), “How to Prepare for Lead Free Soldering”, CALCE Short Course, 2003. Choi, W. , Lee, T. , Tu, K. , Celestre, R. , MacDowell, A. , Bong, Y. , Sheng, G. , (2002), Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, 2002. , (2002) Relay Failure Caused by Tin Whiskers, 2002. , (1989) “Reflow Soldering Survey”, Circuits Manufacturing, p. 42, 1989. Dubravka Rocak, Vinko Stopar, and Janeta Fajfar Plut, (1995), “Solder Paste for Fine Line Printing in Hybrid Microelectronics”, J.

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